同大類學(xué)科其它級別期刊:
中科院 1區(qū) 期刊 JCR Q1 期刊 中科院 2區(qū) 期刊 JCR Q2 期刊 中科院 3區(qū) 期刊 JCR Q3 期刊 中科院 4區(qū) 期刊 JCR Q4 期刊國際簡稱:IEEE T RELIAB 參考譯名:可靠性交易
主要研究方向:工程技術(shù)-工程:電子與電氣 非預(yù)警期刊 審稿周期: 約4.5個(gè)月
《可靠性交易》(Ieee Transactions On Reliability)是一本由Institute of Electrical and Electronics Engineers Inc.出版的以工程技術(shù)-工程:電子與電氣為研究特色的國際期刊,發(fā)表該領(lǐng)域相關(guān)的原創(chuàng)研究文章、評論文章和綜述文章,及時(shí)報(bào)道該領(lǐng)域相關(guān)理論、實(shí)踐和應(yīng)用學(xué)科的最新發(fā)現(xiàn),旨在促進(jìn)該學(xué)科領(lǐng)域科學(xué)信息的快速交流。該期刊是一本未開放期刊,近三年沒有被列入預(yù)警名單。該期刊享有很高的科學(xué)聲譽(yù),影響因子不斷增加,發(fā)行量也同樣高。
IEEE Transactions on Reliability is a refereed journal for the reliability and allied disciplines including, but not limited to, maintainability, physics of failure, life testing, prognostics, design and manufacture for reliability, reliability for systems of systems, network availability, mission success, warranty, safety, and various measures of effectiveness. Topics eligible for publication range from hardware to software, from materials to systems, from consumer and industrial devices to manufacturing plants, from individual items to networks, from techniques for making things better to ways of predicting and measuring behavior in the field. As an engineering subject that supports new and existing technologies, we constantly expand into new areas of the assurance sciences.
CiteScore | SJR | SNIP | CiteScore 指數(shù) | ||||||||||||
12.2 | 1.511 | 1.989 |
|
名詞解釋:CiteScore 是衡量期刊所發(fā)表文獻(xiàn)的平均受引用次數(shù),是在 Scopus 中衡量期刊影響力的另一個(gè)指標(biāo)。當(dāng)年CiteScore 的計(jì)算依據(jù)是期刊最近4年(含計(jì)算年度)的被引次數(shù)除以該期刊近四年發(fā)表的文獻(xiàn)數(shù)。例如,2022年的 CiteScore 計(jì)算方法為:2022年的 CiteScore =2019-2022年收到的對2019-2022年發(fā)表的文件的引用數(shù)量÷2019-2022年發(fā)布的文獻(xiàn)數(shù)量 注:文獻(xiàn)類型包括:文章、評論、會(huì)議論文、書籍章節(jié)和數(shù)據(jù)論文。
Top期刊 | 綜述期刊 | 大類學(xué)科 | 小類學(xué)科 | ||
否 | 否 | 計(jì)算機(jī)科學(xué) | 2區(qū) | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計(jì)算機(jī):硬件 COMPUTER SCIENCE, SOFTWARE ENGINEERING 計(jì)算機(jī):軟件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 2區(qū) 2區(qū) 2區(qū) |
Top期刊 | 綜述期刊 | 大類學(xué)科 | 小類學(xué)科 | ||
否 | 否 | 計(jì)算機(jī)科學(xué) | 2區(qū) | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計(jì)算機(jī):硬件 COMPUTER SCIENCE, SOFTWARE ENGINEERING 計(jì)算機(jī):軟件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 2區(qū) 2區(qū) 2區(qū) |
Top期刊 | 綜述期刊 | 大類學(xué)科 | 小類學(xué)科 | ||
是 | 否 | 計(jì)算機(jī)科學(xué) | 2區(qū) | COMPUTER SCIENCE, SOFTWARE ENGINEERING 計(jì)算機(jī):軟件工程 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計(jì)算機(jī):硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 1區(qū) 2區(qū) 2區(qū) |
Top期刊 | 綜述期刊 | 大類學(xué)科 | 小類學(xué)科 | ||
否 | 否 | 工程技術(shù) | 3區(qū) | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計(jì)算機(jī):硬件 COMPUTER SCIENCE, SOFTWARE ENGINEERING 計(jì)算機(jī):軟件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 3區(qū) 2區(qū) 3區(qū) |
Top期刊 | 綜述期刊 | 大類學(xué)科 | 小類學(xué)科 | ||
是 | 否 | 計(jì)算機(jī)科學(xué) | 2區(qū) | COMPUTER SCIENCE, SOFTWARE ENGINEERING 計(jì)算機(jī):軟件工程 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計(jì)算機(jī):硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 1區(qū) 2區(qū) 2區(qū) |
Top期刊 | 綜述期刊 | 大類學(xué)科 | 小類學(xué)科 | ||
否 | 否 | 計(jì)算機(jī)科學(xué) | 2區(qū) | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計(jì)算機(jī):硬件 COMPUTER SCIENCE, SOFTWARE ENGINEERING 計(jì)算機(jī):軟件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 2區(qū) 2區(qū) 2區(qū) |
按JIF指標(biāo)學(xué)科分區(qū) | 收錄子集 | 分區(qū) | 排名 | 百分位 |
學(xué)科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE | SCIE | Q1 | 8 / 59 |
87.3% |
學(xué)科:COMPUTER SCIENCE, SOFTWARE ENGINEERING | SCIE | Q1 | 13 / 131 |
90.5% |
學(xué)科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q1 | 65 / 352 |
81.7% |
按JCI指標(biāo)學(xué)科分區(qū) | 收錄子集 | 分區(qū) | 排名 | 百分位 |
學(xué)科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE | SCIE | Q1 | 7 / 59 |
88.98% |
學(xué)科:COMPUTER SCIENCE, SOFTWARE ENGINEERING | SCIE | Q1 | 14 / 131 |
89.69% |
學(xué)科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q1 | 42 / 354 |
88.28% |
Author: He, Yan-Lin; Li, Kun; Liang, Li-Long; Xu, Yuan; Zhu, Qun-Xiong
Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 166-176. DOI: 10.1109/TR.2021.3115108
Author: Huang, Yanze; Lin, Limei; Lin, Yuhang; Xu, Li; Hsieh, Sun-Yuan
Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 372-383. DOI: 10.1109/TR.2021.3129257
Author: Zhang, Ning; Xu, Yuan; Zhu, Qun-Xiong; He, Yan-Lin
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Author: Wang, Kai; Xu, Zhaoping; Liu, Yu; Fang, Yiping
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Author: Kou, Gang; Yi, Kunxiang; Xiao, Hui; Peng, Rui
Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 3-14. DOI: 10.1109/TR.2022.3161638
Author: Gong, Hongfang; Li, Renfa; An, Jiyao; Xie, Guoqi
Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 224-239. DOI: 10.1109/TR.2022.3160460
Author: Gong, Siqian; Zhu, Xiaomin; Zhang, Runtong; Zhao, Hongmei; Guo, Chao
Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 329-342. DOI: 10.1109/TR.2022.3161359
Engineering Applications Of Artificial Intelligence
中科院 2區(qū) JCR Q1
Journal Of Intelligent & Fuzzy Systems
中科院 4區(qū) JCR Q3
Journal Of Big Data
中科院 2區(qū) JCR Q1
Cybersecurity
中科院 4區(qū) JCR Q1
Information Technology And Control
中科院 4區(qū) JCR Q3
Neurocomputing
中科院 2區(qū) JCR Q1
Internet Of Things
中科院 3區(qū) JCR Q1
Big Data Mining And Analytics
中科院 1區(qū) JCR Q1
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